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University of Illinois at Urbana-Champaign

Studies on the Brittle -Ductile Transition in Silicon

Abstract

dc:description

After a specimen geometry that ensures straight crack growth was found for the experiment described above, research on crack turning was continued. As a hot glass plate is dipped into cool water, a pre-crack may grow along many different paths depending upon the testing parameters. In silicon the crack favors the cleavage planes. A cohesive-element model modified for thermally-driven cracks reproduced many of the experimental crack morphologies.

Degree

thesis:*
Name thesis:degree_name
Ph.D.
Level thesis:degree_level
Dissertation
Discipline thesis:degree_discipline
Theoretical and Applied Mechanics
Grantor
University of Illinois at Urbana-Champaign
Year dc:date
2015

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Ferney, Brook David
Contributors dc:contributor
  • Hsia, K. Jimmy

Subjects

dc:subject × 1

Rights

Language dc:language
eng

Identifiers

dc:identifier.*
Identifier
(MiAaPQ)AAI3017073
OAI identifier oai:identifier
oai:www.ideals.illinois.edu:2142/87694

Chain of custody

source
Harvested from
University of Illinois - Urbana-Champaign
Base URL
www.ideals.illinois.edu/oai-pmh
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Ferney, Brook David. Studies on the Brittle -Ductile Transition in Silicon. Dissertation thesis, University of Illinois at Urbana-Champaign, 2015. http://hdl.handle.net/2142/87694