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University of Illinois at Urbana-Champaign
Studies on the Brittle -Ductile Transition in Silicon
Abstract
dc:descriptionAfter a specimen geometry that ensures straight crack growth was found for the experiment described above, research on crack turning was continued. As a hot glass plate is dipped into cool water, a pre-crack may grow along many different paths depending upon the testing parameters. In silicon the crack favors the cleavage planes. A cohesive-element model modified for thermally-driven cracks reproduced many of the experimental crack morphologies.
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Theoretical and Applied Mechanics
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2015
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Ferney, Brook David
- Contributors dc:contributor
-
- Hsia, K. Jimmy
Subjects
dc:subject × 1Rights
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
- (MiAaPQ)AAI3017073
- OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/87694