Back to results

University of Illinois at Urbana-Champaign

Failure and Fracture of Thin Film Materials for MEMS

Abstract

dc:description

The results of this research provided fundamental information about thin film failure at the scale of MEMS, which could be directly applied to perform materials selection and design of MEMS components. The experimental methods described in this thesis were shown to be entirely repeatable and directly applicable to any thin film material. Consequently, they represent a protocol with the potential to become a standardized technique for mechanical property studies at the micron and the nanometer scales.

Degree

thesis:*
Name thesis:degree_name
Ph.D.
Level thesis:degree_level
Dissertation
Discipline thesis:degree_discipline
Aerospace Engineering
Grantor
University of Illinois at Urbana-Champaign
Year dc:date
2015

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Jonnalagadda, Krishna Nagasai
Contributors dc:contributor
  • Chasiotis, Ioannis

Subjects

dc:subject × 1

Rights

Language dc:language
eng

Identifiers

dc:identifier.*
Identifier
(MiAaPQ)AAI3314810
OAI identifier oai:identifier
oai:www.ideals.illinois.edu:2142/85109

Chain of custody

source
Harvested from
University of Illinois - Urbana-Champaign
Base URL
www.ideals.illinois.edu/oai-pmh
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Jonnalagadda, Krishna Nagasai. Failure and Fracture of Thin Film Materials for MEMS. Dissertation thesis, University of Illinois at Urbana-Champaign, 2015. http://hdl.handle.net/2142/85109