In-Situ Micro Testing Techniques for Electro-Thermo-Mechanical Characterization of Nano/micro-Scale Materials

100-nm-thick Al films deposited at two different conditions and having different grain sizes were compared for their thermal behavior by in-situ TEM annealing. The sample having grain size of 250 nm showed grain growth while that with 55-nm grains displayed no grain growth up to melting. The difference is attributed to larger concentration of oxygen in the latter sample. However, when the film having 55-nm grain size was interfaced with a SiO 2 layer, grain growth was seen near the melting, possibly because of the increased stress induced from thermal mismatch. Also, 4-point electrical resistance measurement was performed on 100-nm thick Al film. Its temperature-dependent response was normal metallic linear behavior except that the initial resistivity was about 10 times higher than the bulk value.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Mechanical Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Han, Jong Hee

Contributors dc:contributor

• Saif, M. Taher A.

• Engineering, Mechanical

Language dc:language

eng

Identifier

(MiAaPQ)AAI3290243

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/83884