Design of Improved Polyester Dielectric Insulators for Electronic Packaging

First, the foaming methods used to lower the dielectric constant of the copolyester thermoset to 2.5 $\rm (25\sp\circ C,$ 1 kHz) are described. Second, the nature of the increase in melting temperature of the liquid crystalline copolyesters upon annealing near their original melting temperature to improve the dimensional stability is elucidated. Lastly, a description of a new photosensitive copolyester dielectric insulator is presented.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Materials Science and Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Schneggenburger, Lizabeth Ann

Contributors dc:contributor

• Economy, James

• Engineering, Packaging

Language dc:language

eng

Identifier

(MiAaPQ)AAI9834738

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/82904