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University of Illinois at Urbana-Champaign

Transfer Printing and Micro-Scale Hybrid Materials Systems

Abstract

dc:description

Micro- and nano-scale engineering, especially as it applies to integrated circuits, has impacted society in revolutionary ways. These integrated circuits are characterized by huge numbers of small electronic devices manufactured on semiconductor wafers. Some emerging technologies will require assemblies of these micro/nano-devices on substrates that are very different from semiconductor wafers in terms of processing schemes and properties. Integration of high quality semiconductors and devices onto large, low-cost, mechanically- deformable, polymeric (plastic or elastomer), and/or functional substrates for unconventional electronics applications (displays, systems-on-a-chip) are a few examples. This dissertation presents methods for assembling small-scale (∼nm to ∼mm) materials elements and devices on many classes of substrate (planar or simply-curved with nearly arbitrary composition) via transfer printing, a form of soft lithography. The approach uses rubber stamps to manipulate arrays of small-scale objects including but not limited to carbon nanotubes, metal thin films, single-crystal silicon and III-V semiconductor microstructures and devices, few-layer graphene, and silica microspheres. Presented here are the techniques for preparing printable materials elements and devices from solution (e.g. surfactant stabilized aqueous carbon nanotube solutions) and from donor/source substrates (e.g. semiconductor wafers) as well as the mechanical phenomena that govern the transfer of materials to and from the stamp. Among these are kinetically-switchable adhesion to a viscoelastic stamp and stress focusing via sharp geometries for controlling fracture. Also presented here are thin-film transistors, photodiodes, and inorganic light-emitting diodes on plastic substrates as well as semiconductor woodpile structures and silicon-III-V heterogeneous integration, examples of the capabilities of the transfer printing approach.

Degree

thesis:*
Name thesis:degree_name
Ph.D.
Level thesis:degree_level
Dissertation
Discipline thesis:degree_discipline
Materials Science and Engineering
Grantor
University of Illinois at Urbana-Champaign
Year dc:date
2015

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Meitl, Matthew Alexander
Contributors dc:contributor
  • Rogers, John A.

Subjects

dc:subject × 1

Rights

Language dc:language
eng

Identifiers

dc:identifier.*
Identifier
(MiAaPQ)AAI3290320
OAI identifier oai:identifier
oai:www.ideals.illinois.edu:2142/82809

Chain of custody

source
Harvested from
University of Illinois - Urbana-Champaign
Base URL
www.ideals.illinois.edu/oai-pmh
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Meitl, Matthew Alexander. Transfer Printing and Micro-Scale Hybrid Materials Systems. Dissertation thesis, University of Illinois at Urbana-Champaign, 2015. http://hdl.handle.net/2142/82809