Monte Carlo Simulations of the Electrodeposition of Copper From a Sulfate Solution in the Presence of Additives

A simple copper deposition model was developed and compared to the experimental results in three ways, qualitative visual comparisons, scaling analysis of the interface width and current time curves. Parametric studies were performed to make observations about the modeled copper system. A hypothetical blocking additive was introduced into the model to see its effects on the deposition processes. The blocker additive was used to improve the filling of a trench by electrodeposition. The concentration and properties of the blocker were varied to see their effect on the trench filling. Additional hypothetical additive and multi additive systems also were tested including a surfactant, an accelerator and a multistage additive.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Chemical Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Pricer, Timothy James

Contributors dc:contributor

• Alkire, Richard C.

• Engineering, Chemical

Language dc:language

eng

Identifier

(MiAaPQ)AAI9990114

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/82482