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University of Illinois at Urbana-Champaign
Investigation of the Influence of a Model Additive System on Copper Electrodeposition: Integration of Experiments on the Surface Morphology Evolution With Multiscale Simulation
Abstract
dc:descriptionIn the last chapter, copper electroplating behavior on electrodeposited ruthenium surface was briefly discussed.
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Chemical Engineering
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2015
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Xue, Feng
- Contributors dc:contributor
-
- Alkire, Richard C.
Subjects
dc:subject × 1Rights
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
- (MiAaPQ)AAI3202187
- OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/82379