Precision Self -Alignment Techniques for Optoelectronic Integration

Basic techniques used for the integration and precise self-alignment of optoelectronic components are presented. State-of-the-art self-alignment accuracies have been achieved using solder bump arrays for component alignment and etched V-grooves for optical fiber alignment. The self-alignment potential of eutectic tin-silver solder bump arrays to produce sub-quarter-micron alignment precision is demonstrated. The potential for V-groove dimensional control to enable sub-half-micron optical fiber positioning is also demonstrated. Optimal materials and conditions are discussed. Novel fabrication procedures are presented, such as the use of an adhesion layer to facilitate solder reflow and a V-groove planarization process to facilitate planar processing. The combination of these techniques for the integration of optoelectronic components with the provision of mutual alignment between them is also discussed.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Electrical Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Flachsbart, Bruce

Contributors dc:contributor

• Hsieh, Kuang-Chien

• Engineering, Metallurgy

Language dc:language

eng

Identifier

(MiAaPQ)AAI9944851

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/81291