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University of Illinois at Urbana-Champaign
Models for Yield Estimation of Multichip Module Ceramic Substrates
Abstract
dc:descriptionWe present improved yield models that can be used for a broader range of printed patterns. We also enhance the defect geometry models that are commonly used today. We introduce a defect geometry model that is based on the physical process of defect formation. Our defect geometry model employs Markov random fields to represent more general defect shapes. Yield is estimated using Monte Carlo sampling methods. Finally, we present methods for estimating the parameters of the yield models using observed data from the manufacturing process.
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Electrical Engineering
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2015
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Castano, Rebecca L.
- Contributors dc:contributor
-
- Seth Hutchinson
Subjects
dc:subject × 1Rights
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
- (MiAaPQ)AAI9834658
- OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/81220