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University of Illinois at Urbana-Champaign
Electrothermal Simulation and Temperature-Sensitive Reliability Diagnosis for CMOS VLSI Circuits
Abstract
dc:descriptionILLIADS-T has been successfully applied to the electromigration (EM) reliability diagnosis and timing analysis. By considering both transistor and interconnect temperatures, the temperature-sensitive EM-induced mean time-to-failure and critical path timing are estimated and discussed.
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Electrical Engineering
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2015
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Cheng, Yi-Kan
- Contributors dc:contributor
-
- Kang, Sung-Mo (Steve)
Subjects
dc:subject × 1Rights
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
- (MiAaPQ)AAI9812555
- OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/81203