University of Illinois at Urbana-Champaign
Methodologies for Broadband Electromagnetic Modeling of on-Chip Semiconductor Substrate Noise
Abstract
dc:descriptionFor a full-wave modeling of the substrate coupling problem the thesis elaborates on a number of features for the time domain finite integration technique (FIT), a volumetric discretization scheme, aimed at improving its computational performance for the type of geometrical characteristics encountered in substrate coupling problems on-chip. Along these lines, the implicit Newmark-beta scheme is proposed as the time-marching scheme to overcome the severe restrictions on the maximum stable time step imposed by stability constraints to the more frequently used explicit leapfrog scheme. Furthermore, a previously proposed FDTD subgridding scheme, based on a finite element method (FEM) formalism, has been reformulated and adapted to work within the FIT framework. One important element of the presented subgridding scheme is that it maintains the transpose property between the discrete curl operators for electric and magnetic fields. This is a key ingredient for the implementation of a global discrete system that is energy conserving, consistent with the modeled continuous problem; hence any subgridding induced, late time instabilities are avoided.
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Electrical and Computer Engineering
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2015
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Manetas, George
- Contributors dc:contributor
-
- Cangellaris, Andreas C.
Subjects
dc:subject × 1Rights
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
- (MiAaPQ)AAI3392208
- OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/81144