Electromagnetic Modeling of the Power Distribution Network in Packaged Integrated Circuits Using a Hybrid Extended Segmentation Method

We have developed a modular extended segmentation procedure for the electromagnetic modeling of the power distribution network in packaged integrated circuits. The fundamental blocks that build the power distribution network are identified and modeled individually. An integral equation approach is employed for the electromagnetic simulation of the field on the boundary of the parallel-plate metallization pairs and circuit models, and finite methods are used for the local discontinuities. In particular, finite differences in the frequency domain are employed to model splits in metallization planes, vias and pins. Circuit models are used to capture the field behavior at the boundaries and at plane bifurcations. The technique includes the incorporation of lumped elements. The network multiport is formed in a hierarchical systematic manner. Furthermore, a special methodology for the incorporation of the various loss mechanisms present in real structures is introduced. Finally, a rational function interpolation technique is incorporated in the extended segmentation framework. The main attributes of the proposed methodology are its modularity and its computational efficiency. As the field is described in terms of an equivalent electromagnetic problem on the boundary of the domain, the number of unknowns increases linearly with the periphery length. Another significant contribution of the method is that it allows for the a priori modeling of the discontinuities. This leads to enhanced computational efficiency, as one model per discontinuity type would suffice to model a large number of identical discontinuities. Also, due to the fact that the system is described in terms of generic multiports in the subsystem level, the method helps with the electrical performance assessment during the design phase. The accuracy and the effectiveness of the proposed methodology are demonstrated through several validation studies and through its application to realistic board designs.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Electrical and Computer Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Kollia, Varvara

Contributors dc:contributor

• Cangellaris, Andreas C.

• Engineering, Electronics and Electrical

Language dc:language

eng

Identifier

(MiAaPQ)AAI3337830

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/81096