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University of Illinois at Urbana-Champaign
Repair of Thermal Injury in Conidia of Aspergillus Parasiticus
Abstract
dc:descriptionMade available in DSpace on 2014-12-13T19:47:42Z (GMT). No. of bitstreams: 1 7913368.pdf: 4936807 bytes, checksum: 2d47df68d145dcd4de08f5e86fa4ada9 (MD5) Previous issue date: 1978
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Food Science
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2014
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Adams, Gary Hite
Subjects
dc:subject × 1Rights
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
- (UMI)AAI7913368
- OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/66963