Interfacial physics in meniscus-confined electrodeposition and its applications for fabricating electronic structures

A novel three-dimensional micro-/nano-fabrication method, the meniscus-confined electrodeposition, was developed and studied. It exploits the thermodynamic stability of a microscale or nanoscale liquid meniscus to direct-write pure metallic three-dimensional structures of designed shapes and sizes in an ambient air environment. This technique is cost-effective to implement and is based on the principle of electrodeposition, and can thus be applied to fabricate structures made of a wide variety of materials. In this work, theoretically, a detailed analysis was provided for describing the growth parameters essential for the meniscus-confined electrodeposition process; experimentally, various techniques were developed to fabricate structures with demanding shapes and dimensions for specific electrical and electrochemical applications.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Mechanical Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2011

Author dc:creator

• Hu, Jie

Contributors dc:contributor

• Yu, Min-Feng
• Ferreira, Placid M.
• King, William P.
• Kim, Kyekyoon

• Meniscus-confined Electrodeposition
• Nanoprobes
• Wire Bonding
• 3-D Structures

Statement dc:rights

• Copyright 2011 Jie Hu

Language dc:language

en

Handle dc:identifier

http://hdl.handle.net/2142/24476

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/24476