A unified approach for assessing circuit and packaging technologies in a system environment

Several important aspects are present in any unified approach to evaluating future technologies and packaging alternatives in a system environment. These include how to link the architecture of the system to the physical system design, how to model the devices and interconnections, how to realistically predict system size, and how to measure the length of the interconnections. In this thesis we consider these four aspects of a unified system approach to assessing technology and packaging alternatives in a system environment.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Electrical and Computer Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2011

Author dc:creator

• Gura, Carol V.

Contributors dc:contributor

• Abraham, Jacob A.

• Engineering, Electronics and Electrical

Statement dc:rights

• Copyright 1990 Gura, Carol Valentina

Language dc:language

eng

Identifier

AAI9021689
(UMI)AAI9021689

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/22531