Microstructures and mechanical properties of the sputter deposited copper(x) tantalum(1-x) films

Copper-refractory metal composites/alloys are of interest for aerospace and related applications requiring good thermal conductivity and high strength at elevated temperatures. These materials, due to generally very low mutual solubilities, may allow development of high strength microstructures which retain their physical properties at temperatures for exceeding those suitable for precipitation strengthened alloys.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Materials Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2011

Author dc:creator

• Wang, Hong

Contributors dc:contributor

• Rigsbee, J. Michael

• Engineering, Metallurgy
• Engineering, Materials Science

Statement dc:rights

• Copyright 1994 Wang, Hong

Language dc:language

eng

Identifier

AAI9512587
(UMI)AAI9512587

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/21386