Some molecular contributions and curing considerations: Physical properties of thermoset network materials

Three topics on the molecular basis of, and processing effects on, thermoset network behavior are investigated: (1) processing thick section prepreg epoxy materials, (2) characterization of the contributions to rubbery elastic behavior and (3) improved epoxy resins through lightly cross-linked stiff molecular backbones.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Materials Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2011

Author dc:creator

• Twardowski, Thomas E., Jr

Contributors dc:contributor

• Geil, Phillip H.

• Chemistry, Physical
• Plastics Technology

Statement dc:rights

• Copyright 1992 Twardowski, Thomas E., Jr

Language dc:language

eng

Identifier

AAI9236612
(UMI)AAI9236612

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/21344