A study of copper thick film conductor adhesion mechanisms on ceramic substrates

In this study, copper thick film adhesion mechanisms and its failure modes on different ceramic substrates (glass ceramic, $\rm Al\sb2O\sb3$ and AlN) were investigated as a function of aging time at 150$\sp\circ$C in the presence of Pb/Sn solders. The copper thick film inks were formulated from copper powder, glass frit and CuO, an ink additive. The inks were then screen printed onto the substrates and fired at 900$\sp\circ$C in N$\sb2$ ambient containing less than 10 ppm of O$\sb2$. A statistical multiple linear regression analysis was successfully employed in the development of the glass frit and the selection of the ink additives. Adhesion strength of the fired films was measured by a modified Dupont peel test procedure. Various surfaces and interfaces of the thick film samples were analyzed using optical microscopy, electronprobe microanalysis (EPMA), and high resolution scanning electron microscopy (SEM) techniques. X-ray diffraction and thermal analyses (TMA and TGA) techniques were used to analyze the ink additives.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Materials Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2011

Author dc:creator

• Perecherla, Raju A.

Contributors dc:contributor

• Buchanan, Relva C.

• Engineering, Materials Science

Statement dc:rights

• Copyright 1992 Perecherla, Raju A.

Language dc:language

eng

Identifier

AAI9522198
(UMI)AAI9522198

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/20762