University of Illinois at Urbana-Champaign
Stress and stick-slip analyses for optical fiber pull-out and thin film peel tests
Abstract
dc:descriptionThis work is divided mainly into two topics: the stress and birefringence analyses of polarization-maintaining optical fibers, and the stick-slip analyses of the topical fiber pull-out experiment and the thin-film peel test. For the first topic, the exact stress distribution in the fiber cross section is found in a closed form for various optical fibers using the complex variable method with superposition techniques. The average core and center core birefringences of each fiber are derived and calculated. Among all the fibers studied, the bow-tie fiber produces the highest birefringence. For the second topic, the experiment of fiber pull-out accompanying the stick-slip process is performed by pulling an embedded optical fiber from an epoxy matrix and a theoretical analysis is carried out for thin-film stick-slip peeling. The common feature of the stick-slip behavior in these two experiments is that the stick-slip amplitude and frequency depend on the pulling or peeling speed. From the fiber pull-out experiment, the stick-slip sliding is believed due not only to the local constitutive behavior of the contact interface but also to non-uniform sliding of the two deformable surfaces. With the aid of photoelasticity, the non-uniform sliding process of the two deformable surfaces is studied. For the analysis of thin-film peeling, a quasistatic slender beam theory is employed including bending and stretching. The stick-slip analysis is carried out for both the 90$\sp\circ$ peel test and the roller peel test. It is found that bending effect is in general so important that it cannot be neglected. For the 90$\sp\circ$ peel test, the stick-slip period and frequency are found to be dependent on the Young's modulus, thickness and length of the peeled film; the dependence is different for the bending and stretching dominant cases. For the roller peel test, it is found that, as the peeling speed is increased, the stick-slip amplitude decreases and the frequency increases. Furthermore, the analysis offers an explanation for the very high frequency noise that is usually generated during stick-slip peeling.
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Applied Mechanics
- Grantor
- University of Illinois at Urbana-Champaign
- Date dc:date
- 10000-01-01
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Tsai, Kun-Hsieh
- Contributors dc:contributor
-
- Kim, Kyung-Suk
Subjects
dc:subject × 2Rights
dc:rights- Statement dc:rights
-
- Copyright 1992 Tsai, Kun-Hsieh
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
-
AAI9215898
(UMI)AAI9215898 - OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/20439