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University of Illinois at Urbana-Champaign
Diffusion along twist grain boundaries in copper
Abstract
dc:descriptionU of I Only
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Materials Science and Engineering
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2011
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Nomura, Miki
- Contributors dc:contributor
-
- Adams, James B.
Subjects
dc:subject × 1Rights
dc:rights- Statement dc:rights
-
- Copyright 1996 Nomura, Miki
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
-
AAI9625174
(UMI)AAI9625174 - OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/19462