Thermo-optic Phase Spectroscopy techniques for multiscale thermal conductance characterization in semiconductor integrated circuits

Thermal management remains a critical challenge in the advancement of semiconductor integrated circuits, particularly with the emergence of three-dimensional (3D) architectures for high-performance applications. This thesis introduces Thermo-optic Phase Spectroscopy (TOPS), a family of non-destructive techniques for multiscale thermal conductance characterization across bulk materials, buried films and interfaces, and nanoscale films. Three variants are developed: Displacement TOPS (D-TOPS) for bulk solids, Immersion TOPS (I-TOPS) for deeply embedded films and interfaces, and High-Resolution TOPS (HR-TOPS) for nanoscale semiconductor films. Each technique combines AC laser heating, temperature sensing via probe beam deflection, and analytical modeling to extract thermal properties with high spatial resolution, sensitivity, and speed. A unified modeling framework accommodates multilayer structures with anisotropic thermal expansion and elastic constants. Experimental validation demonstrates TOPS’s ability to extract thermal conductivity and thermal boundary conductance with improved accuracy and reduced acquisition time compared to conventional methods. By enabling precise thermal conductance characterization across multiple scales, TOPS provides essential data for optimizing fabrication processes, improving thermal simulations, and guiding temperature sensor placement in next-generation IC designs.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Materials Science & Engr

Grantor

University of Illinois Urbana-Champaign

Year dc:date

2025

Author dc:creator

• Sun, Jinchi

Contributors dc:contributor

• Cahill, David G.
• Cao, Qing
• Sinha, Sanjiv
• Anderson, Christopher P.

• Thermo-optic Phase Spectroscopy (TOPS)
• Thermal conductance characterization
• Semiconductor integrated circuits
• AC laser heating
• Probe beam deflection
• Multiscale thermal analysis
• 3D IC architectures
• Buried interfaces
• Thermal boundary conductance
• Nanoscale thin films

Statement dc:rights

• Copyright 2025 Jinchi Sun

Language dc:language

en

Handle dc:identifier

https://hdl.handle.net/2142/132746

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/132746