Wear-resistant thermal interface material (TIM) for quad/octal small form factor pluggable (QSFP/OSFP) modules

Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2027-08-01

Name thesis:degree_name

M.S.

Level thesis:degree_level

Thesis

Discipline thesis:degree_discipline

Mechanical Engineering

Grantor

University of Illinois Urbana-Champaign

Year dc:date

2025

Author dc:creator

• Patil, Parth Sandip

Contributors dc:contributor

• Sinha, Sanjiv

• Thermal Interface Material
• Diamond Like Carbon
• Osfp/qsfp Modules
• Fabrication
• Thermal Contact Resistance
• Interface
• Mechanical Characterization
• Thermal Characterization
• Silver Dendrites

Statement dc:rights

• Copyright 2025 Parth Sandip Patil

Language dc:language

en, eng

Handle dc:identifier

https://hdl.handle.net/2142/130202

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/130202