University of Illinois Urbana-Champaign
Thermal performance analysis of next generation high performance computing data centers using waterfall diagrams
Abstract
dc:descriptionThermal management in high-density computing data centers is crucial for maintaining performance, reliability, and energy efficiency. As computing power demands surge, traditional air-cooling methods face limitations in handling increasing heat loads, while liquid cooling offers a feasible solution. However, a system-level metric and analysis assessing the energy efficiency of liquid cooling remains absent. This paper introduces a novel waterfall diagram (WFD) framework to provide a comprehensive system-level analysis of liquid cooling performance. The WFD evaluates energy efficiency using total-power usage effectiveness (TUE) derived from analytical calculations. A comparative analysis of coolant distribution unit (CDU) designs identified the 3U CDU architecture as the most suitable configuration for WFD analysis due to its optimal power consumption, TUE, and power density. The WFD analysis also incorporates the Sankey and heat load diagrams to visualize energy flow and heat load accumulation across the cooling system. Results indicate that the secondary side yields the highest pressure drop, which emphasizes opportunities for hydraulic performance optimization. In addition, at the component level, the cooler’s low pressure drop highlights its energy efficiency while, at the system level, the cooler and tube connections make a significant contribution to system TUE, suggesting areas of improvement for energy efficiency. This framework relies on analytical methods without empirical validation and assumes steady-state conditions, which may limit its applicability. Future work should focus on experimental validation and transient thermal analysis. Additionally, the WFD methodology can be extended to different data center cooling methods and other thermal management systems such as hybrid air-liquid cooling, immersion cooling, HVAC, and battery cooling.
Degree
thesis:*- Name thesis:degree_name
- M.S.
- Level thesis:degree_level
- Thesis
- Discipline thesis:degree_discipline
- Mechanical Engineering
- Grantor
- University of Illinois Urbana-Champaign
- Year dc:date
- 2025
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Lee, Donggun
- Contributors dc:contributor
-
- Miljkovic, Nenad
Subjects
dc:subject × 3Rights
dc:rights- Statement dc:rights
-
- Copyright 2025 Donggun Lee
- Language dc:language
- en, eng
Identifiers
dc:identifier.*- Handle dc:identifier
- https://hdl.handle.net/2142/130013