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University of Illinois at Urbana-Champaign

Failures caused by supply fluctuations during system-level ESD

Abstract

dc:description

It is necessary to design robust electronic systems against system-level electrostatic discharge (ESD). In additional to withstanding ESD without hard failures (permanent damage), it is important that the system is robust against soft failures (recoverable loss of function or data), which can be caused by ESD-induced noise on signal inputs and power nets. Besides radiation, the current injection into the circuit alone can cause these disturbances, especially the sharp current spike of a high amplitude in system-level ESD. The waveform of this current is similar in various ESD test setups. Circuit models with distributed elements enable accurate modeling of the system-level ESD current in contact discharge. Experiments have shown that ESD-induced noise on signal traces starts to disturb the IO input at very low ESD levels, and the effectiveness of the transient voltage suppressor (TVS) on board is limited. The noise on supply is global to integrated circuit (IC), as it travels across all the power domains. The waveform of the noise depends on the polarity of the ESD current and the type of ESD protection. The experiments have shown that the supply fluctuation can be quite severe, as a strong reverse of the on-chip supply is indicated by monitor circuits starting from the ESD levels below the common required passing level. This poses a requirement of a minimum amount of on-chip decoupling capacitances (decaps) to limit the amplitude of supply fluctuations. This requirement is similar whether the supply voltage is generated on-chip or off-chip, as long as a large amount of off-chip decap is used and connected to the board ground. If the supply voltage is generated on-chip, the regulator needs to be carefully designed against ESD induced noise. In addition, the rail clamp, if not optimized, deteriorates the power integrity with its instability. The ESD-induced supply fluctuation may cause latch-up without careful attention to the well-bias scheme.

Degree

thesis:*
Name thesis:degree_name
Ph.D.
Level thesis:degree_level
Dissertation
Discipline thesis:degree_discipline
Electrical & Computer Engr
Grantor
University of Illinois at Urbana-Champaign
Year dc:date
2018

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Xiu, Yang
Contributors dc:contributor
  • Rosenbaum, Elyse
  • Schutt-Ainé, José E.
  • Hanumolu, Pavan Kumar
  • Gong, Songbin

Subjects

dc:subject × 3

Rights

dc:rights
Statement dc:rights
  • Copyright 2018 Yang Xiu
Language dc:language
en

Identifiers

dc:identifier.*
Handle dc:identifier
http://hdl.handle.net/2142/100889
OAI identifier oai:identifier
oai:www.ideals.illinois.edu:2142/100889

Chain of custody

source
Harvested from
University of Illinois - Urbana-Champaign
Base URL
www.ideals.illinois.edu/oai-pmh
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Xiu, Yang. Failures caused by supply fluctuations during system-level ESD. Dissertation thesis, University of Illinois at Urbana-Champaign, 2018. http://hdl.handle.net/2142/100889