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University of Illinois - Chicago
Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.
Abstract
dc:descriptionEnergy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Md Sajjad. Rahaman (8025680)
Subjects
dc:subject × 2Rights
dc:rights- Statement dc:rights
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- In Copyright
- Restricted Access
Identifiers
dc:identifier.*- Identifier
- 10027/19237
- OAI identifier oai:identifier
- oai:figshare.com:article/11086487