{"id":{"repo_id":"uic","oai_identifier":"oai:figshare.com:article/11086487"},"canonical_url":"https://search.dev.ndltd.org/etd/uic/oai:figshare.com:article/11086487","repository":{"repo_id":"uic","name":"University of Illinois - Chicago","base_url":"https://api.figshare.com/v2/oai"},"display":{"title":"Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.","abstract":"Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.","abstract_html":"Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects.","abstract_has_math":false,"creators":["Md Sajjad. Rahaman (8025680)"],"institution":null,"degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":null,"school":null,"contributors":[],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2014,"date_issued":"2014-12-04T00:00:00Z","date_published":"2014-12-04T00:00:00Z","updated_at":"2026-07-27T21:35:19Z","subjects":["Engineering, Computer.","Engineering, Electronics and Electrical."],"languages":[],"rights":["In Copyright","Restricted Access"],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["10027/19237"],"render_values":[{"text":"10027/19237","href":null,"code":true}]}]},"links":{"outbound_url":null,"outbound_label":null,"outbound_source":null},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:creator","label":"Author","values":["Md Sajjad. Rahaman (8025680)"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2014-12-04T00:00:00Z"]},{"key":"dc:relation","label":"Dc Relation","values":["https://figshare.com/articles/thesis/Energy-_and_Reliability-Aware_Design_of_High-Speed_Global_On-Chip_Interconnects_/11086487"]},{"key":"dc:type","label":"Dc Type","values":["Text","Thesis"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Engineering, Computer.","Engineering, Electronics and Electrical."]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:rights","label":"Dc Rights","values":["In Copyright","Restricted Access"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["10027/19237"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects."]},{"key":"dc:title","label":"Title","values":["Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects."]}]}],"canonical_facts":{"dc:creator":["Md Sajjad. Rahaman (8025680)"],"dc:date":["2014-12-04T00:00:00Z"],"dc:description":["Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects."],"dc:identifier":["10027/19237"],"dc:relation":["https://figshare.com/articles/thesis/Energy-_and_Reliability-Aware_Design_of_High-Speed_Global_On-Chip_Interconnects_/11086487"],"dc:rights":["In Copyright","Restricted Access"],"dc:subject":["Engineering, Computer.","Engineering, Electronics and Electrical."],"dc:title":["Energy- and Reliability-Aware Design of High-Speed Global On-Chip Interconnects."],"dc:type":["Text","Thesis"]},"updated_at":"2026-07-27T21:35:19Z"}