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Università degli studi di Trento

Development of Small-Pitch, Thin 3D Sensors for Pixel Detector Upgrades at HL-LHC

Abstract

dc:description

3D Si radiation sensors came along with extreme radiation hard properties, primarily owing to the geometrical advantages over planar sensors where electrodes are formed penetrating through the active substrate volume. Among them: reduction of the inter-electrode distance, lower depletion voltage requirement, inter-columnar high electric field distribution, lower trapping probability, faster charge collection capability, lower power dissipation, and lower inter-pitch charge sharing. Since several years, FBK has developed 3D sensors with a double-sided technology, that have also been installed in the ATLAS Insertable B-Layer at LHC. However, the future High-Luminosity LHC (HL-LHC) upgrades, aimed to be operational by 2024, impose a complete swap of current 3D detectors with more radiation hard sensor design, able to withstand very large particle fluences up to 2×1016 cm-2 1-MeV equivalent neutrons. The extreme luminosity conditions and related issues in occupancy and radiation hardness lead to very dense pixel granularity (50×50 or 25×100 μm2), thinner active region (~100 μm), narrower columnar electrodes (~5μm diameter) with reduced inter-electrode spacing (~30 μm), and very slim edges (~100 μm) into the 3D pixel sensor design. This thesis includes the development of this new generation of small-pitch and thin 3D radiation sensors aimed at the foreseen Inner Tracker (ITk) upgrades at HL-LHC.

Degree

thesis:*
Grantor dc:publisher
Università degli studi di Trento
Year dc:date
2017

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Sultan, D M S
Contributors dc:contributor
  • Dalla Betta, Gian Franco

Subjects

dc:subject × 4

Rights

dc:rights
Statement dc:rights
  • info:eu-repo/semantics/openAccess
  • license:Tutti i diritti riservati (All rights reserved)
  • license uri:iris.PRI01
Language dc:language
eng

Identifiers

dc:identifier.*
OAI identifier oai:identifier
oai:iris.unitn.it:11572/367699

Chain of custody

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Università degli Studi di Trento
Base URL
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Last updated
2026-07-24
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citation

Sultan, D M S. Development of Small-Pitch, Thin 3D Sensors for Pixel Detector Upgrades at HL-LHC. Università degli studi di Trento, 2017. https://hdl.handle.net/11572/367699