{"id":{"repo_id":"trento","oai_identifier":"oai:iris.unitn.it:11572/367699"},"canonical_url":"https://search.dev.ndltd.org/etd/trento/oai:iris.unitn.it:11572/367699","repository":{"repo_id":"trento","name":"Università degli Studi di Trento","base_url":"https://iris.unitn.it/oai/request"},"display":{"title":"Development of Small-Pitch, Thin 3D Sensors for Pixel Detector Upgrades at HL-LHC","abstract":"3D Si radiation sensors came along with extreme radiation hard properties, primarily owing to the geometrical advantages over planar sensors where electrodes are formed penetrating through the active substrate volume. Among them: reduction of the inter-electrode distance, lower depletion voltage requirement, inter-columnar high electric field distribution, lower trapping probability, faster charge collection capability, lower power dissipation, and lower inter-pitch charge sharing. Since several years, FBK has developed 3D sensors with a double-sided technology, that have also been installed in the ATLAS Insertable B-Layer at LHC. However, the future High-Luminosity LHC (HL-LHC) upgrades, aimed to be operational by 2024, impose a complete swap of current 3D detectors with more radiation hard sensor design, able to withstand very large particle fluences up to 2×1016 cm-2 1-MeV equivalent neutrons. The extreme luminosity conditions and related issues in occupancy and radiation hardness lead to very dense pixel granularity (50×50 or 25×100 μm2), thinner active region (~100 μm), narrower columnar electrodes (~5μm diameter) with reduced inter-electrode spacing (~30 μm), and very slim edges (~100 μm) into the 3D pixel sensor design. This thesis includes the development of this new generation of small-pitch and thin 3D radiation sensors aimed at the foreseen Inner Tracker (ITk) upgrades at HL-LHC.","abstract_html":"3D Si radiation sensors came along with extreme radiation hard properties, primarily owing to the geometrical advantages over planar sensors where electrodes are formed penetrating through the active substrate volume. Among them: reduction of the inter-electrode distance, lower depletion voltage requirement, inter-columnar high electric field distribution, lower trapping probability, faster charge collection capability, lower power dissipation, and lower inter-pitch charge sharing. Since several years, FBK has developed 3D sensors with a double-sided technology, that have also been installed in the ATLAS Insertable B-Layer at LHC. However, the future High-Luminosity LHC (HL-LHC) upgrades, aimed to be operational by 2024, impose a complete swap of current 3D detectors with more radiation hard sensor design, able to withstand very large particle fluences up to 2×1016 cm-2 1-MeV equivalent neutrons. The extreme luminosity conditions and related issues in occupancy and radiation hardness lead to very dense pixel granularity (50×50 or 25×100 μm2), thinner active region (~100 μm), narrower columnar electrodes (~5μm diameter) with reduced inter-electrode spacing (~30 μm), and very slim edges (~100 μm) into the 3D pixel sensor design. This thesis includes the development of this new generation of small-pitch and thin 3D radiation sensors aimed at the foreseen Inner Tracker (ITk) upgrades at HL-LHC.","abstract_has_math":false,"creators":["Sultan, D M S"],"institution":"Università degli studi di Trento","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":null,"school":null,"contributors":["Dalla Betta, Gian Franco"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2017,"date_issued":"2017","date_published":"2017","updated_at":"2026-07-24T05:04:15Z","subjects":["Settore ING-IND/20 - Misure e Strumentazione Nucleari","Settore ING-INF/07 - Misure Elettriche e Elettroniche","Settore ING-INF/01 - Elettronica","Settore FIS/01 - Fisica Sperimentale"],"languages":["eng"],"rights":["info:eu-repo/semantics/openAccess","license:Tutti i diritti riservati (All rights reserved)","license uri:iris.PRI01"],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["http://dx.doi.org/10.15168/11572_367699","10.15168/11572_367699"],"render_values":[{"text":"http://dx.doi.org/10.15168/11572_367699","href":"http://dx.doi.org/10.15168/11572_367699","code":true},{"text":"10.15168/11572_367699","href":"https://doi.org/10.15168/11572_367699","code":true}]}]},"links":{"outbound_url":"https://hdl.handle.net/11572/367699","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Sultan, D M S","Dalla Betta, Gian Franco"]},{"key":"dc:creator","label":"Author","values":["Sultan, D M S"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2017"]},{"key":"dc:publisher","label":"Institution","values":["Università degli studi di Trento","place:TRENTO"]},{"key":"dc:relation","label":"Dc Relation","values":["firstpage:1","lastpage:184","numberofpages:184"]},{"key":"dc:type","label":"Dc Type","values":["info:eu-repo/semantics/doctoralThesis"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Settore ING-IND/20 - Misure e Strumentazione Nucleari","Settore ING-INF/07 - Misure Elettriche e Elettroniche","Settore ING-INF/01 - Elettronica","Settore FIS/01 - Fisica Sperimentale"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["eng"]},{"key":"dc:rights","label":"Dc Rights","values":["info:eu-repo/semantics/openAccess","license:Tutti i diritti riservati (All rights reserved)","license uri:iris.PRI01"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["https://hdl.handle.net/11572/367699","http://dx.doi.org/10.15168/11572_367699","10.15168/11572_367699"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["3D Si radiation sensors came along with extreme radiation hard properties, primarily owing to the geometrical advantages over planar sensors where electrodes are formed penetrating through the active substrate volume. Among them: reduction of the inter-electrode distance, lower depletion voltage requirement, inter-columnar high electric field distribution, lower trapping probability, faster charge collection capability, lower power dissipation, and lower inter-pitch charge sharing. Since several years, FBK has developed 3D sensors with a double-sided technology, that have also been installed in the ATLAS Insertable B-Layer at LHC. However, the future High-Luminosity LHC (HL-LHC) upgrades, aimed to be operational by 2024, impose a complete swap of current 3D detectors with more radiation hard sensor design, able to withstand very large particle fluences up to 2×1016 cm-2 1-MeV equivalent neutrons. The extreme luminosity conditions and related issues in occupancy and radiation hardness lead to very dense pixel granularity (50×50 or 25×100 μm2), thinner active region (~100 μm), narrower columnar electrodes (~5μm diameter) with reduced inter-electrode spacing (~30 μm), and very slim edges (~100 μm) into the 3D pixel sensor design. This thesis includes the development of this new generation of small-pitch and thin 3D radiation sensors aimed at the foreseen Inner Tracker (ITk) upgrades at HL-LHC."]},{"key":"dc:title","label":"Title","values":["Development of Small-Pitch, Thin 3D Sensors for Pixel Detector Upgrades at HL-LHC"]}]}],"canonical_facts":{"dc:contributor":["Sultan, D M S","Dalla Betta, Gian Franco"],"dc:creator":["Sultan, D M S"],"dc:date":["2017"],"dc:description":["3D Si radiation sensors came along with extreme radiation hard properties, primarily owing to the geometrical advantages over planar sensors where electrodes are formed penetrating through the active substrate volume. Among them: reduction of the inter-electrode distance, lower depletion voltage requirement, inter-columnar high electric field distribution, lower trapping probability, faster charge collection capability, lower power dissipation, and lower inter-pitch charge sharing. Since several years, FBK has developed 3D sensors with a double-sided technology, that have also been installed in the ATLAS Insertable B-Layer at LHC. However, the future High-Luminosity LHC (HL-LHC) upgrades, aimed to be operational by 2024, impose a complete swap of current 3D detectors with more radiation hard sensor design, able to withstand very large particle fluences up to 2×1016 cm-2 1-MeV equivalent neutrons. The extreme luminosity conditions and related issues in occupancy and radiation hardness lead to very dense pixel granularity (50×50 or 25×100 μm2), thinner active region (~100 μm), narrower columnar electrodes (~5μm diameter) with reduced inter-electrode spacing (~30 μm), and very slim edges (~100 μm) into the 3D pixel sensor design. This thesis includes the development of this new generation of small-pitch and thin 3D radiation sensors aimed at the foreseen Inner Tracker (ITk) upgrades at HL-LHC."],"dc:identifier":["https://hdl.handle.net/11572/367699","http://dx.doi.org/10.15168/11572_367699","10.15168/11572_367699"],"dc:language":["eng"],"dc:publisher":["Università degli studi di Trento","place:TRENTO"],"dc:relation":["firstpage:1","lastpage:184","numberofpages:184"],"dc:rights":["info:eu-repo/semantics/openAccess","license:Tutti i diritti riservati (All rights reserved)","license uri:iris.PRI01"],"dc:subject":["Settore ING-IND/20 - Misure e Strumentazione Nucleari","Settore ING-INF/07 - Misure Elettriche e Elettroniche","Settore ING-INF/01 - Elettronica","Settore FIS/01 - Fisica Sperimentale"],"dc:title":["Development of Small-Pitch, Thin 3D Sensors for Pixel Detector Upgrades at HL-LHC"],"dc:type":["info:eu-repo/semantics/doctoralThesis"]},"updated_at":"2026-07-24T05:04:15Z"}