Design of a Mold Insert Alignment System for Double-Sided Hot Embossing of Microfluidic Devices Using Kinematic Constraints

The fabrication of microfluidic devices using hot embossing has increased in complexity. Many systems are multi component systems requiring that each be aligned properly with its mating components. Double-sided hot embossing is often used to produce stackable components for these assemblies. Accurate alignment of the two mold inserts, and therefore the opposing faces of the substrate, is a critical aspect to successful assembly of multi-layered modules. A cost effective alignment system based on kinematic constraints was designed, fabricated, and tested to determine the accuracy and precision of the system. Double-sided substrates were hot embossed and characterized to evaluate the effectiveness of the design.

Name thesis:degree_name

Master of Science in Technology

Level thesis:degree_level

Masters

Discipline thesis:degree_discipline

Industrial Technology

Grantor

Texas State University-San Marcos

Year dc:date.issued

2013

Author dc:creator

• Conner, Timothy Glenn

Advisor dc:contributor.advisor

• You, Byoung Hee

Committee members dc:contributor.committeemember

• Song, In-Houk
• Sriraman, Vedaraman

• double-sided micro hot embossing
• alignment
• kinematic constraint
• microfluidics
• interconnection

Language dc:language.iso

en

Handle dc:identifier.uri

https://hdl.handle.net/10877/4892

OAI identifier oai:identifier

oai:digital.library.txst.edu:10877/4892