{"id":{"repo_id":"texas-state","oai_identifier":"oai:digital.library.txst.edu:10877/4892"},"canonical_url":"https://search.dev.ndltd.org/etd/texas-state/oai:digital.library.txst.edu:10877/4892","repository":{"repo_id":"texas-state","name":"Texas State University","base_url":"https://digital.library.txst.edu/server/oai/request"},"display":{"title":"Design of a Mold Insert Alignment System for Double-Sided Hot Embossing of Microfluidic Devices Using Kinematic Constraints","abstract":"The fabrication of microfluidic devices using hot embossing has increased in complexity. Many systems are multi component systems requiring that each be aligned properly with its mating components. Double-sided hot embossing is often used to produce stackable components for these assemblies. Accurate alignment of the two mold inserts, and therefore the opposing faces of the substrate, is a critical aspect to successful assembly of multi-layered modules. A cost effective alignment system based on kinematic constraints was designed, fabricated, and tested to determine the accuracy and precision of the system. Double-sided substrates were hot embossed and characterized to evaluate the effectiveness of the design.","abstract_html":"The fabrication of microfluidic devices using hot embossing has increased in complexity. Many systems are multi component systems requiring that each be aligned properly with its mating components. Double-sided hot embossing is often used to produce stackable components for these assemblies. Accurate alignment of the two mold inserts, and therefore the opposing faces of the substrate, is a critical aspect to successful assembly of multi-layered modules. A cost effective alignment system based on kinematic constraints was designed, fabricated, and tested to determine the accuracy and precision of the system. Double-sided substrates were hot embossed and characterized to evaluate the effectiveness of the design.","abstract_has_math":false,"creators":["Conner, Timothy Glenn"],"institution":"Texas State University-San Marcos","degree_name":"Master of Science in Technology","degree_level":"Masters","degree_discipline":"Industrial Technology","degree_department":null,"school":null,"contributors":[],"advisors":["You, Byoung Hee"],"committee_chairs":[],"committee_members":["Song, In-Houk","Sriraman, Vedaraman"],"year":2013,"date_issued":"2013-11","date_published":"2013-11","updated_at":"2026-07-27T21:22:49Z","subjects":["double-sided micro hot embossing","alignment","kinematic constraint","microfluidics","interconnection"],"languages":["en"],"rights":[],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"https://hdl.handle.net/10877/4892","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor.advisor","label":"Advisor","values":["You, Byoung Hee"]},{"key":"dc:contributor.committeemember","label":"Committee Member","values":["Song, In-Houk","Sriraman, Vedaraman"]},{"key":"dc:creator","label":"Author","values":["Conner, Timothy Glenn"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.accessioned","label":"Dc Date Accessioned","values":["2013-11-27T18:09:05Z"]},{"key":"dc:date.available","label":"Dc Date Available","values":["2013-11-27T18:09:05Z"]},{"key":"dc:date.issued","label":"Date","values":["2013-11"]},{"key":"dc:type","label":"Dc Type","values":["Thesis"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Industrial Technology"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Masters"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Master of Science in Technology"]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["Texas State University-San Marcos"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["double-sided micro hot embossing","alignment","kinematic constraint","microfluidics","interconnection"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language.iso","label":"Language (ISO)","values":["en"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier.uri","label":"Identifier URI","values":["https://hdl.handle.net/10877/4892"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description.abstract","label":"Abstract","values":["The fabrication of microfluidic devices using hot embossing has increased in complexity. Many systems are multi component systems requiring that each be aligned properly with its mating components. Double-sided hot embossing is often used to produce stackable components for these assemblies. Accurate alignment of the two mold inserts, and therefore the opposing faces of the substrate, is a critical aspect to successful assembly of multi-layered modules. A cost effective alignment system based on kinematic constraints was designed, fabricated, and tested to determine the accuracy and precision of the system. Double-sided substrates were hot embossed and characterized to evaluate the effectiveness of the design."]},{"key":"dc:format","label":"Dc Format","values":["Text"]},{"key":"dc:format.medium","label":"Dc Format Medium","values":["1 file (.pdf)"]},{"key":"dc:title","label":"Title","values":["Design of a Mold Insert Alignment System for Double-Sided Hot Embossing of Microfluidic Devices Using Kinematic Constraints"]}]}],"canonical_facts":{"dc:contributor.advisor":["You, Byoung Hee"],"dc:contributor.committeemember":["Song, In-Houk","Sriraman, Vedaraman"],"dc:creator":["Conner, Timothy Glenn"],"dc:date.accessioned":["2013-11-27T18:09:05Z"],"dc:date.available":["2013-11-27T18:09:05Z"],"dc:date.issued":["2013-11"],"dc:description.abstract":["The fabrication of microfluidic devices using hot embossing has increased in complexity. Many systems are multi component systems requiring that each be aligned properly with its mating components. Double-sided hot embossing is often used to produce stackable components for these assemblies. Accurate alignment of the two mold inserts, and therefore the opposing faces of the substrate, is a critical aspect to successful assembly of multi-layered modules. A cost effective alignment system based on kinematic constraints was designed, fabricated, and tested to determine the accuracy and precision of the system. Double-sided substrates were hot embossed and characterized to evaluate the effectiveness of the design."],"dc:format":["Text"],"dc:format.medium":["1 file (.pdf)"],"dc:identifier.uri":["https://hdl.handle.net/10877/4892"],"dc:language.iso":["en"],"dc:subject":["double-sided micro hot embossing","alignment","kinematic constraint","microfluidics","interconnection"],"dc:title":["Design of a Mold Insert Alignment System for Double-Sided Hot Embossing of Microfluidic Devices Using Kinematic Constraints"],"dc:type":["Thesis"],"thesis:degree_discipline":["Industrial Technology"],"thesis:degree_level":["Masters"],"thesis:degree_name":["Master of Science in Technology"],"thesis:institution_name":["Texas State University-San Marcos"]},"updated_at":"2026-07-27T21:22:49Z"}