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Rochester Institute of Technology

Adhesion of sputtered copper to plasma-treated polyimide substrates

dc:creator Ma, Jong-Bong

Degree

thesis:*

Level thesis:degree_level: Thesis

Author and committee

dc:creator, dc:contributor.*

Author dc:creator: Ma, Jong-Bong
Contributors dc:contributor: Not listed

Subjects

dc:subject × 4

Identifiers

dc:identifier.*

Repository record dc:identifier: https://repository.rit.edu/theses/4500
OAI identifier oai:identifier: oai:repository.rit.edu:theses-5504

Chain of custody

source

Harvested from: Rochester Institute of Technology
Base URL: repository.rit.edu/do/oai/
Last updated: 2026-07-27
Source record: OAI-PMH GetRecord

related terms

citation

Ma, Jong-Bong. Adhesion of sputtered copper to plasma-treated polyimide substrates. Thesis thesis, https://repository.rit.edu/theses/4500

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