Analysis of column interconnects for wafer level packages

This thesis focuses on the solder joint thermo-mechanical reliability analysis of Copper column (CuC) interconnect for wafer level packages. First, a simulation-based design optimization process was established based on ABAQUS and Minitab. This process integrated finite element simulation, design of experiment and numerical optimization, generating a systematic and efficient method that can study the effects of various design parameters on system response. Secondly, two new advanced finite element simulation methodologies, based on modeling chip/substrate as shells and interconnects as beams, together with shell-to-solid coupling and submodeling techniques, were developed to address the modeling difficulty of CuC interconnect in large packages with ultra-fine pitch. A feasibility demonstration of the two methodologies was firstly given. After this, as a case study, shell-and-beam-submodeling approach was chosen for solder joint fatigue life prediction of three different CuC interconnects in 20mm by 20mm wafer level packages with 100A?m pitch.

Author dc:creator

• SUN WEI

• interconnect, fatigue, finite element analysis, submodeling, design of experiment, wafer level packaging