{"id":{"repo_id":"nus","oai_identifier":"oai:scholarbank.nus.edu.sg:10635/15222"},"canonical_url":"https://search.dev.ndltd.org/etd/nus/oai:scholarbank.nus.edu.sg:10635/15222","repository":{"repo_id":"nus","name":"National University of Singapore","base_url":"https://scholarbank.nus.edu.sg/oai/request"},"display":{"title":"Analysis of column interconnects for wafer level packages","abstract":"This thesis focuses on the solder joint thermo-mechanical reliability analysis of Copper column (CuC) interconnect for wafer level packages. First, a simulation-based design optimization process was established based on ABAQUS and Minitab. This process integrated finite element simulation, design of experiment and numerical optimization, generating a systematic and efficient method that can study the effects of various design parameters on system response. Secondly, two new advanced finite element simulation methodologies, based on modeling chip/substrate as shells and interconnects as beams, together with shell-to-solid coupling and submodeling techniques, were developed to address the modeling difficulty of CuC interconnect in large packages with ultra-fine pitch. A feasibility demonstration of the two methodologies was firstly given. After this, as a case study, shell-and-beam-submodeling approach was chosen for solder joint fatigue life prediction of three different CuC interconnects in 20mm by 20mm wafer level packages with 100A?m pitch.","abstract_html":"This thesis focuses on the solder joint thermo-mechanical reliability analysis of Copper column (CuC) interconnect for wafer level packages. First, a simulation-based design optimization process was established based on ABAQUS and Minitab. This process integrated finite element simulation, design of experiment and numerical optimization, generating a systematic and efficient method that can study the effects of various design parameters on system response. Secondly, two new advanced finite element simulation methodologies, based on modeling chip/substrate as shells and interconnects as beams, together with shell-to-solid coupling and submodeling techniques, were developed to address the modeling difficulty of CuC interconnect in large packages with ultra-fine pitch. A feasibility demonstration of the two methodologies was firstly given. After this, as a case study, shell-and-beam-submodeling approach was chosen for solder joint fatigue life prediction of three different CuC interconnects in 20mm by 20mm wafer level packages with 100A?m pitch.","abstract_has_math":false,"creators":["SUN WEI"],"institution":null,"degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":null,"school":null,"contributors":[],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2006,"date_issued":"2006-03-21","date_published":"2006-03-21","updated_at":"2026-07-24T03:31:13Z","subjects":["interconnect, fatigue, finite element analysis, submodeling, design of experiment, wafer level packaging"],"languages":[],"rights":[],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":null,"outbound_label":null,"outbound_source":null},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:creator","label":"Author","values":["SUN WEI"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.issued","label":"Date","values":["2006-03-21"]},{"key":"dc:relation.isreferencedby","label":"Dc Relation Isreferencedby","values":["https://scholarbank.nus.edu.sg/handle/10635/15222"]},{"key":"dc:type","label":"Dc Type","values":["Thesis"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["interconnect, fatigue, finite element analysis, submodeling, design of experiment, wafer level packaging"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier.uri","label":"Identifier URI","values":["https://scholarbank.nus.edu.sg/bitstreams/b1f5eb4a-e7ff-45ce-b03f-32fb69984c84/download"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description.abstract","label":"Abstract","values":["This thesis focuses on the solder joint thermo-mechanical reliability analysis of Copper column (CuC) interconnect for wafer level packages. 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This process integrated finite element simulation, design of experiment and numerical optimization, generating a systematic and efficient method that can study the effects of various design parameters on system response. Secondly, two new advanced finite element simulation methodologies, based on modeling chip/substrate as shells and interconnects as beams, together with shell-to-solid coupling and submodeling techniques, were developed to address the modeling difficulty of CuC interconnect in large packages with ultra-fine pitch. A feasibility demonstration of the two methodologies was firstly given. 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