Effect of temperature on the fracture behavior of lead-free solder joints

The objective of the present study is to examine the effect of temperature on the fracture behavior of Cu-SAC305-Cu joints. To this end, double cantilever beam (DCB) specimens, consisting of a thin layer of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars, fabricated under standard surface mount (SMT) processing conditions are fractured under various temperatures with a MTS machine equipped with an environment chamber. The load-displacement behavior corresponding to crack initiation and the subsequent toughening before ultimate failure and the displacements near crack tip are recorded and used to calculate the fracture energy release rates. The fracture surfaces and the crack path analyses are conducted with a scanning electron microscope to understand the effect of temperature on the mechanism of fracture. These results provide new information to manufacturers of microelectronics packages, which could be used to further improve package reliability.

Name thesis:degree_name

Master of Science in Mechanical Engineering - (M.S.)

Discipline thesis:degree_discipline

Mechanical and Industrial Engineering

Year

2016

Author dc:creator

• Thompson, Patrick

Contributors dc:contributor

• Siva P.V. Nadimpalli
• I. Joga Rao
• Anthony D. Rosato

• Fracture behavior
• Lead-free solder joints
• Temperature effects
• Mechanical Engineering

Repository record dc:identifier

https://digitalcommons.njit.edu/theses/280

OAI identifier oai:identifier

oai:digitalcommons.njit.edu:theses-1279