Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 159 for “"solder"”.
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Piezo-induced fatigue of solder joints
… to investigate the damage mechanisms in solder joints for electronic packaging applications under cyclic loading conditions. Analytical results are derived for the plastic shear strain at the free edges of such a specimen using a shear lag model. Results are also presented for the strain …
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Solder self-assembly for MEMS fabrication
… onto substrates using the capillary force of solder. This is an order of magnitude smaller than current solder self-assembly in the literature. This thesis also examines self-assembly of high aspect ratio (2:1) microfabricated structures, which poses a greater challenge in terms of alignment …
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Non-destructive evaluation of solder joint reliability
… evaluation technique is presented in which a key solder joint feature, nucleating at the bump to silicon interface and propagating across a laminar crack plane is captured and tracked using acoustic microscopy imaging (AMI). The feasibility of this concept was successfully demonstrated by …
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Analysis of surface mount technology solder joints
… the quality of surface mount technology (SMT) solder joints are numerous, and complex. The exploration of these factors, and how they may affect the reliability and quality of the joints can only be achieved through continuous research. In this project, essential areas of SMT joints were …
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Modelling to predict the reliability of solder joints
… modelling methods to predict the reliability of solder joints under thermo-mechanical cycling. A literature review is presented covering analytical methods, creep laws and fatigue laws, and advanced damage mechanics methods. The use of FEA (Finite Element Analysis) to model creep along with a …
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Testing and inverse modelling for solder joint reliability assessment
… of slowing down, the reliability of lead free solder joints with diminishing size has become more and more a challenge to the design engineers and the electronics manufacturing industry. In order to predict the reliability of solder joints accurately, it is necessary to develop test techniques …
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Real time process monitoring of solder paste stencil printing
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994.
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Thermal fatigue of solder joints in micro-electronic devices
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1986.
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Numerical study of solder joint failure under fast loading conditions
… study was undertaken to investigate the solder joint failure under fast loading conditions. The finite element model assumes a lap-shear testing configuration, where the solder joint is bonded to two copper substrates. A progressive ductile damage model was incorporated into the …
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On-line non-destructive ultrasonic rheology measurement of solder pastes
… mount technology (SMT) electronics assembly, the solder paste is printed onto the PCB's surface through a stencil and the components are later placed over the solder paste deposits. Since 2007, the use of extremely small SMT components for assembly of SMT devices has been widespread, and achieving …
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Roles of Interfacial Reaction on Mechanical Properties of Solder Interfaces
In Bi-containing solder interfacial system, we found that Bi segregated to the Cu-intermetallic interface during aging in SnBi/Cu interconnect. This caused serious embrittlement of Sn-Bi/Cu interface. Further aging induced numerous voids along the Cu3Sn/Cu interface. These interfacial voids were …
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Predicting solder defects in printed circuit board assembly (PCBA) process
… instance, x-ray inspection, which mostly detects solder defects, has a yield of about 97% for one of Flex's automated PCBA lines, and an improvement even to just 98% would create significant cost savings. Given this opportunity, this project aims to use the new data captured by the first steps in …
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Strain-rate Dependent Fracture Load Prediction of Lead-free Solder Joints
… has been shown to govern the fracture of short solder joints. The present work measured Jci for 2 mm long SAC305 solder joints as a function of the strain rate and phase angle using DCB specimens. A drop tester was designed and built to perform the experiments at higher strain rates. Jci …
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Modelling of solder interconnection’s performance in photovoltaic modules for reliability prediction
… has been the untimely fatigue failure of solder interconnections of solar cells in the modules due to accelerated thermo-mechanical degradation. The goal of this research is to provide adequate information for proper design of solar cell solder joint against fatigue failure through the …
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HARMONIC AND RANDOM VIBRATION DURABILITY INVESTIGATION FOR SAC305 (Sn3.0Ag0.5Cu) SOLDER JOINT
… less investigated. In surface mount technology, solder joints are the primary mechanical, thermal and electrical interconnects between the component and the PWB. So the reliability of solder joints is very crucial for most electronic assemblies. The vibration durability of Pb-free solder joints …
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Thermodynamic modeling of solder melting and solidification for proposed squishbot design
… and tested. Under these conditions, the solder melting phase transition took 2.25 seconds to melt and 2.65 seconds to solidify. These results, as well as observations about the behavior of the program's numerical solver, seem to suggest that the proposed joint locking system is feasible. …
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Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
… techniques. On the other hand, advanced solder joint area-array technologies, such as flip-chip technology, has emerged in microelectronics industry due to increased speed, higher packaging density, and performance, improved reliability and low cost these technologies offer. With all …
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Effects of underfill material on solder deformation and damage in 3D packages
… of an FEA model that is representative of a solder joint in a 3D IC package. The model solder joint is placed between two silicon substrates in contact with through-silicon vias without any other devices or components attached. Differing solder joint thicknesses, both with and without …
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Effect of temperature on the fracture behavior of lead-free solder joints
… of a thin layer of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars, fabricated under standard surface mount (SMT) processing conditions are fractured under various temperatures with a MTS machine equipped with an environment chamber. The load-displacement behavior …
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