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Massachusetts Institute of Technology

Characterizing the thermal efficiency of thermoelectric modules

Abstract

dc:description.abstract

An experimental setup was designed and utilized to measure the thermoelectric properties as functions of temperature of a commercially available, bismuth telluride thermoelectric module. Thermoelectric modules are solid state semiconducting devices that act reversibly as both a heat pump and a power generator. The experimental setup encased the modules in an insulating container and thermal power was provided by a variable power cartridge heater, using type-K thermocouples to measure the temperature difference across the module. The measured parameters were compared against published data on a similar type of module. The thermal conductivity was measured within 21% of the accepted value on average, the Seebeck coefficient within 16%, the figure of merit within a factor two, and the thermal efficiency within 20% for low [delta]T of less than 25°C.

Degree

thesis:*
Department dc:contributor.department
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2009

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Phillips, Samuel S
Advisor dc:contributor.advisor
  • Gang Chen.

Subjects

dc:subject × 1

Rights

dc:rights
Statement dc:rights
  • M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Language dc:language.iso
eng

Identifiers

dc:identifier.*
Handle dc:identifier.uri
http://hdl.handle.net/1721.1/54524
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/54524

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Phillips, Samuel S. Characterizing the thermal efficiency of thermoelectric modules. Massachusetts Institute of Technology, 2009. http://hdl.handle.net/1721.1/54524