{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/54524"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/54524","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"Characterizing the thermal efficiency of thermoelectric modules","abstract":"An experimental setup was designed and utilized to measure the thermoelectric properties as functions of temperature of a commercially available, bismuth telluride thermoelectric module. Thermoelectric modules are solid state semiconducting devices that act reversibly as both a heat pump and a power generator. The experimental setup encased the modules in an insulating container and thermal power was provided by a variable power cartridge heater, using type-K thermocouples to measure the temperature difference across the module. The measured parameters were compared against published data on a similar type of module. The thermal conductivity was measured within 21% of the accepted value on average, the Seebeck coefficient within 16%, the figure of merit within a factor two, and the thermal efficiency within 20% for low [delta]T of less than 25°C.","abstract_html":"An experimental setup was designed and utilized to measure the thermoelectric properties as functions of temperature of a commercially available, bismuth telluride thermoelectric module. Thermoelectric modules are solid state semiconducting devices that act reversibly as both a heat pump and a power generator. The experimental setup encased the modules in an insulating container and thermal power was provided by a variable power cartridge heater, using type-K thermocouples to measure the temperature difference across the module. The measured parameters were compared against published data on a similar type of module. The thermal conductivity was measured within 21% of the accepted value on average, the Seebeck coefficient within 16%, the figure of merit within a factor two, and the thermal efficiency within 20% for low [delta]T of less than 25°C.","abstract_has_math":false,"creators":["Phillips, Samuel S"],"institution":"Massachusetts Institute of Technology","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":"Massachusetts Institute of Technology. Dept. of Mechanical Engineering.","school":null,"contributors":[],"advisors":["Gang Chen."],"committee_chairs":[],"committee_members":[],"year":2009,"date_issued":"2009","date_published":"2009","updated_at":"2026-07-22T22:21:26Z","subjects":["Mechanical Engineering."],"languages":["eng"],"rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."],"rights_urls":["http://dspace.mit.edu/handle/1721.1/7582"],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/1721.1/54524","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor.advisor","label":"Advisor","values":["Gang Chen."]},{"key":"dc:contributor.department","label":"Department","values":["Massachusetts Institute of Technology. Dept. of Mechanical Engineering."]},{"key":"dc:contributor.other","label":"Dc Contributor Other","values":["Massachusetts Institute of Technology. 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The experimental setup encased the modules in an insulating container and thermal power was provided by a variable power cartridge heater, using type-K thermocouples to measure the temperature difference across the module. The measured parameters were compared against published data on a similar type of module. The thermal conductivity was measured within 21% of the accepted value on average, the Seebeck coefficient within 16%, the figure of merit within a factor two, and the thermal efficiency within 20% for low [delta]T of less than 25°C."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["S.B."]},{"key":"dc:title","label":"Title","values":["Characterizing the thermal efficiency of thermoelectric modules"]}]}],"canonical_facts":{"dc:contributor.advisor":["Gang Chen."],"dc:contributor.department":["Massachusetts Institute of Technology. Dept. of Mechanical Engineering."],"dc:contributor.other":["Massachusetts Institute of Technology. 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The measured parameters were compared against published data on a similar type of module. The thermal conductivity was measured within 21% of the accepted value on average, the Seebeck coefficient within 16%, the figure of merit within a factor two, and the thermal efficiency within 20% for low [delta]T of less than 25°C."],"dc:description.degree":["S.B."],"dc:identifier.uri":["http://hdl.handle.net/1721.1/54524"],"dc:language.iso":["eng"],"dc:publisher":["Massachusetts Institute of Technology"],"dc:rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."],"dc:rights.uri":["http://dspace.mit.edu/handle/1721.1/7582"],"dc:subject":["Mechanical Engineering."],"dc:title":["Characterizing the thermal efficiency of thermoelectric modules"],"dc:type":["Thesis"]},"updated_at":"2026-07-22T22:21:26Z"}