Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability

Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management; and, Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Materials Science and Engineering

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

1998

Author dc:creator

• Clough, Sherry L. (Sherry Lynn), 1969-

Advisor dc:contributor.advisor

• Roy Welsch and Frederic McGarry.

• Sloan School of Management
• Materials Science and Engineering

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/50398

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/50398