Massachusetts Institute of Technology
Carbon nanotube based electromechanical probes
Abstract
dc:description.abstractElectromechanical probing applications continuously require smaller pitches, faster manufacturing and lower electrical resistance. Conventional techniques, such as MEMS based cantilever probes have their shortcomings in terms of the lowest pitch that can be achieved, cost and yield. Given their promising mechanical and electrical properties, carbon nanotubes (CNTs) are strong candidates for future probing applications. A new class of metal-CNT hybrid electromechanical probes is presented where vertically aligned carbon nanotube structures, grown with a chemical vapor deposition (CVD) technique, act as elastic springs, and a metal coating on the probes is used for increased electrical conduction. This design and architecture presents a scalable approach where thousands of probes can be fabricated in very short production times. 1.5 Ohm resistance and reliable performance for 6000 cycles at 50 [mu]m over-travel was achieved for a column of 200 [mu]m x 200[mu]m cross-section and 1plm of Au deposition. In-situ scanning electron microscope mechanical compression tests revealed a unique deformation mechanism of the CNT structures where continued compression results in successive buckle formation which later can serve as micro-bellows and elastic springs.
Degree
thesis:*- Department dc:contributor.department
- Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
- Grantor dc:publisher
- Massachusetts Institute of Technology
- Year dc:date.issued
- 2007
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Yaglioglu, Onnik, 1976-
- Advisor dc:contributor.advisor
-
- Alexander H. Slocum.
Subjects
dc:subject × 1Rights
dc:rights- Statement dc:rights
-
- M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
- Licence dc:rights.uri
- Language dc:language.iso
- eng
Identifiers
dc:identifier.*- Handle dc:identifier.uri
- http://hdl.handle.net/1721.1/40357
- OAI identifier oai:identifier
- oai:dspace.mit.edu:1721.1/40357