Environmentally benign manufacturing of three dimensional integrated circuits

Along with scaling down in size, novel materials have been introduced into the semiconductor industry to enable continued improvements in performance and cost as predicted by Moore's law. It has become important now more than ever to include an environmental impact evaluation of future technologies, before they are introduced into manufacturing, in order to identify potentially environmentally harmful materials or processes and understand their implications, costs, and mitigation requirements. In this thesis, we introduce a methodology to compare alternative options on the environmental axis, along with the cost and performance axes, in order to create environmentally aware and benign technologies. This methodology also helps to identify potential performance and cost issues in novel technologies by taking a transparent and bottoms-up assessment approach. This methodology is applied to the evaluation of the MIT 3D IC technology in comparison to a standard CMOS 2D IC approach. Both options are compared on all three axes - performance, cost and environmental impact.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2007

Author dc:creator

• Somani, Ajay

Advisor dc:contributor.advisor

• Duane S. Boning.

• Materials Science and Engineering.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/40350

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/40350