Modeling of pattern dependencies in the fabrication of multilevel copper metallization

Multilevel copper metallization for Ultra-Large-Scale-Integrated (ULSI) circuits is a critical technology needed to meet performance requirements for advanced interconnect technologies with sub-micron dimensions. It is well known that multilevel topography resulting from pattern dependencies in various processes, especially copper Electrochemical Deposition (ECD) and Chemical-Mechanical Planarization (CMP), is a major problem in interconnects. An integrated pattern dependent chip-scale model for multilevel copper metallization is contributed to help understand and meet dishing and erosion requirements, to optimize the combined plating and polishing process to achieve minimal environmental impact, higher yield and performance, and to enable optimization of layout and dummy fill designs. First, a physics-based chip-scale copper ECD model is developed. By considering copper ion depletion effects, and surface additive adsorption and desorption, the plating model is able to predict the initial topography for subsequent CMP modeling with sufficient accuracy and computational efficiency. Second, a compatible chip-scale CMP modeling is developed.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2007

Author dc:creator

• Cai, Hong, Ph. D. Massachusetts Institute of Technology

Advisor dc:contributor.advisor

• Duane S. Boning and Carl V. Thompson.

• Materials Science and Engineering.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/39551

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/39551