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Massachusetts Institute of Technology

Analysis of DRIE uniformity for microelectromechanical systems

Abstract

dc:description.abstract

A quantitative model capturing pattern density effects in Deep Reactive Ion Etch (DRIE), which are important in MEMS, is presented. Our previous work has explored the causes of wafer-level variation and demonstrated die-to-die interactions resulting from pattern density and reactant species consumption. Several reports have focused on experimental evidence and modeling of feature level (aspect ratio) dependencies. This thesis contributes a computationally efficient and effective modeling approach which focuses on layout pattern density-induced nonuniformity in DRIE. This is a key component in an integrated model combining wafer-, die-, and feature-level DRIE dependencies to predict etch depth for an input layout and a characterized etch tool and process. The modeling approach proposed here is inspired by previous work in modeling of chemical mechanical polishing (CMP). Computationally, this involves the convolution of an etch "layout impulse response" function or filter with the layout information (or equivalently but more efficiently the multiplication of FFTs). The proposed model is validated by using a mask layer from the MIT Microengine project as a demonstration layout. The model can be tuned to predict the etch behavior to an accuracy of 0.1% RMS normalized error. Furthermore, a feature level model, which considers the effects of sidewall loading on the depletion of reactants is presented. Finally, methods of synthesizing dummy features to improve across-die uniformity in a layout are explored; a by tiling bare areas of the wafer into "fill zones," an improvement in intra-die uniformity is seen. In summary, a semi-empirical modeling approach has been developed for predicting the layout dependent pattern density nonuniformities present

Degree

thesis:*
Department dc:contributor.department
Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2004

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Hill, Tyrone F. (Tyrone Frank), 1980-
Advisor dc:contributor.advisor
  • Duane S. Boning.

Subjects

dc:subject × 1

Rights

dc:rights
Statement dc:rights
  • M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Language dc:language.iso
eng

Identifiers

dc:identifier.*
Handle dc:identifier.uri
http://hdl.handle.net/1721.1/18060
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/18060

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Hill, Tyrone F. (Tyrone Frank), 1980-. Analysis of DRIE uniformity for microelectromechanical systems. Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/18060