Massachusetts Institute of Technology
GaN electronics for high-temperature applications
Abstract
dc:description.abstractGallium nitride is a promising candidate for high-temperature applications. However, despite the excellent performance shown by early high-temperature prototypes, several issues in traditional lateral AlGaN/GaN HEMTs could cause early degradation and failure under high-temperature operation (over 300°C). These include ohmic degradation, gate leakage, buffer leakage, and poor passivation. Besides, enhancement-mode HEMTs are preferred from the application point of view by reducing the circuit complexity and cost. At the same time, the two-dimensional electron gas induced by AlGaN/GaN heterostructures makes HEMTs be naturally depletion-mode devices. This thesis aims to demonstrate devices capable of high-temperature operation without extra cooling systems by combing gate injections transistors (GITs) with ion-implanted refractory metal contacts. The Si ion implantation in AlGaN/GaN heterostructures was comprehensively studied here regarding implantation conditions, activation annealing conditions, metallization schemes. A self-aligned gate-first process, together with etch-stop process, was developed and optimized to improve fabrication efficiency and device uniformity for large-scale integration. Basic logic building blocks, including inverters, NAND gate, NOR gate, SRAM, and ring oscillator, have been demonstrated and characterized at both room temperature and high temperature.
Degree
thesis:*- Name thesis:degree_name
- Master
- Department dc:contributor.department
- Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
- Grantor dc:publisher
- Massachusetts Institute of Technology
- Year dc:date.issued
- 2020
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Yuan, Mengyang.
- Advisor dc:contributor.advisor
-
- Tomás Palacios.
Subjects
dc:subject × 1Rights
dc:rights- Statement dc:rights
-
- MIT theses may be protected by copyright. Please reuse MIT thesis content according to the MIT Libraries Permissions Policy, which is available through the URL provided.
- Licence dc:rights.uri
- Language dc:language.iso
- eng
Identifiers
dc:identifier.*- Handle dc:identifier.uri
- https://hdl.handle.net/1721.1/128350
- OAI identifier oai:identifier
- oai:dspace.mit.edu:1721.1/128350