Thin-film trench capacitors for silicon and organic packages

The continuous trend towards mega-functional, high-performance and ultra-miniaturized system has been driving the need for advances in novel materials with superior properties leading to thin components, high-density interconnect substrates and interconnections. Power supply and management is becoming a critical bottleneck for the advances in such mega-functional systems because power components do not scale down with the rest of the system resulting in bulky and stand-alone power modules. Amongst the power components, thin film capacitors are considered the most challenging to integrate because of several manufacturability concerns. The challenges are related to process compatibility of high permittivity dielectrics with substrates and high surface area electrodes, yield, leakage and losses. This thesis focuses on novel thin film capacitor technologies that address some of these critical challenges.

Department dc:contributor.department

Materials Science and Engineering

Grantor dc:publisher

Georgia Institute of Technology

Year dc:date.issued

2011

Author dc:creator

• Wang, Yushu

Advisor dc:contributor.advisor

• Tummala, Rao R.

Committee members dc:contributor.committeemember

• Gerhardt, Rosario
• Raj, Pulugurtha Markondeya

• Electrolytic capacitors
• TSV
• Sol-gel
• High density
• Low ESR electrode

Handle dc:identifier.uri

http://hdl.handle.net/1853/42741

OAI identifier oai:identifier

oai:repository.gatech.edu:1853/42741