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Brigham Young University - Provo

Fully Compliant Tensural Bistable Mechanisms (FTBM) with On-Chip Thermal Actuation

Abstract

dc:description.abstract

<p>The Fully compliant Tensural Bistable Mechanism (FTBM) class is introduced. The class consists of fully compliant linear bistable mechanisms that achieve much of their displacement and bistable behavior through tension loading of compliant segments. Multiple topologies of designs arising from the FTBM class were designed using a finite element analysis (FEA) model with optimization. In a coupled design approach, thermal actuators were optimized to the force and displacement requirements of the bistable mech-anisms, and selected FTBM devices were combined in switching systems with the result-ing Thermomechanical In-plane Microactuators (TIMs) and Amplified Thermomechanical In-plane Microactuators (ATIMs). Successful on-chip actuation was demonstrated. The bistable mechanisms and actuators in this work were fabricated in the MUMPs and SUMMiT V surface micromachining MEMS fabrication technologies. The Stacked Amplified Thermomechanical In-plane Microactuator (StATIM) is also introduced. The StATIM is a compact linear output actuator based on the ATIM that is capable of large displacements relative to the size of the actuator. The StATIMs presented in this thesis were fabricated in the SUMMiT V technology.</p>

Degree

thesis:*
Name thesis:degree_name
MS
Grantor dc:publisher
Brigham Young University - Provo

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Wilcox, Daniel L.

Subjects

dc:subject × 8

Rights

Language dc:language
English

Identifiers

dc:identifier.*
Repository record dc:identifier
https://scholarsarchive.byu.edu/etd/169
OAI identifier oai:identifier
oai:scholarsarchive.byu.edu:etd-1168

Chain of custody

source
Harvested from
Brigham Young University
Base URL
scholarsarchive.byu.edu/do/oai/
Last updated
2026-07-24
Source record
OAI-PMH GetRecord
citation

Wilcox, Daniel L.. Fully Compliant Tensural Bistable Mechanisms (FTBM) with On-Chip Thermal Actuation. Brigham Young University - Provo, https://scholarsarchive.byu.edu/etd/169