Development of In-Plane Compliant Bistable Microrelays

Bistable microrelays have many possible applications and have the potential to reduce the size, weight, power consumption, and cost of products in which they are used. This research outlines the current state of microrelays, presents three new compliant bistable micromechanisms, and characterizes their performance as microrelays. The characterization includes a treatment of a new force-tester, a preliminary contact resistance study, contact-force measurements, switching time measurements, insertion loss, AC isolation, breakdown voltage, and DC isolation. This document also includes recommendations for further research.

Name thesis:degree_name

MS

Grantor dc:publisher

Brigham Young University - Provo

Author dc:creator

• Gomm, Troy Alan

• MEMS
• microrelay
• compliant mechanisms
• in-plane compliant
• bistable microrelays
• bistable micromechanisms
• Mechanical Engineering

Language dc:language

English

Repository record dc:identifier

https://scholarsarchive.byu.edu/etd/81

OAI identifier oai:identifier

oai:scholarsarchive.byu.edu:etd-1080