Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
Results
Showing 1 to 8 of 8 for “"multi-chip module"”.
-
The design of a high efficiency RF power amplifier for an MCM process
… RF power amplifier for the Draper Laboratory multi-chip module (MCM) process. A design for a 2.3 GHz PCB amplifier using an enhancement-mode pHEMT device that achieves 68.9% PAE at 30 dBm output power is presented. Analysis of heat management, die connection parasitics, and transmission line …
-
Local Signal Processing of the ALICE Transition Radiation Detector at LHC (CERN)
… acquisition and trigger system. Therefore, a multi chip module has been developped which incorporates two microchips. Detector signals are preamplified and shaped (Preamplifier and Shaper Chip, PASA). Thereafter they are converted from analog to digital and are processed (Tracklet Processing …
-
Miniaturizing microvias for multi-chip modules
… denser packaging. This encompasses a push toward multilevel die, denser metallization, and smaller microvias. In this thesis we investigate the miniaturization of laser-drilled microvias in polyimide dielectric for chips-first multi-chip module (MCM) technology. The challenge is to produce …
-
Thermal Management of Power Electronic Building Blocks
… of Power Electronic Building Block (PEBB) modules, initiated through the Office of Naval Research (ONR), is a promising enabling technology which will promote future electrical power systems. Key in this development is the thermal design of a PEBB packaging scheme that will manage the …
-
Integrated Thermal Design and Optimization Study for Active Integrated Power Electronic Modules (IPEMs)
… of high power density and integrated modules. It has also been realized that higher temperatures do affect reliability due to a variety of physical failure mechanisms that involve thermal stresses and material degradation. Therefore, it is important to consider temperature as design …
-
GaN-Based High-Efficiency, High-Density, High-Frequency Battery Charger for Plug-in Hybrid Electric Vehicle
… several practical design issues are solved. A multi-chip-module (MCM) approach is used to integrate multiple GaN transistors into a package that enables fast, reliable, and efficient switching. The on-resistance and output charge are characterized. In a double pulse test, GaN devices show fast …
-
Electrical and Thermal Characterizations of IGBT Module with Pressure-Free Large-Area Sintered Joints
… during the sintering stage for attaching power chips with area larger than 100 mm2. This extra pressure increased the complexity of the sintering process. The maximum chip size processed by pressure-free sintering, in the published resources, was 6 x 6 mm2. One objective of this work was to …
-
Impact of Device Parametric Tolerances on Current Sharing Behavior of a SiC Half-Bridge Power Module
… a 1.2 kV, 6.5 mΩ, half-bridge, SiC MOSFET power module to evaluate the impact of parametric device tolerances on electrical and thermal performance. Paralleling power devices increases current handling capability for the same bus voltage. However, inherent parametric differences among dies leads …