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Showing 1 to 20 of 343 for “"etch"”.

  1. Graphene etch mask for silicon

    … its mechanical and chemical strength as an etch mask for silicon is tested.We attempt to present the progress toward a working model of a graphene etch mask. The influence of the mask geometry, etch method, etch conditions, substrate quality and other factors will be explored to present a …

    uiuc Repository record for Graphene etch mask for silicon (opens in a new tab)

  2. Virtual metrology for plasma etch processes.

    … with a particular focus on semiconductor plasma etch. Introductory material covering the essentials of plasma physics, plasma etching, plasma measurement techniques, and black-box modelling techniques is rst presented for readers not familiar with these subjects. A comprehensive literature review …

    maynooth Repository record for Virtual metrology for plasma etch processes. (opens in a new tab)

  3. Novel etch-stop materials for silicon micromachining

    Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1997.

    mit Repository record for Novel etch-stop materials for silicon micromachining (opens in a new tab)

  4. Mechanism of fluoride-based etch and clean processes

    Fluoride-containing solutions are widely used to etch silicon dioxide-based films. A critical issue in integrated circuit (IC) and microelectromechanical systems (MEMS) fabrication is achievement of adequate selectivity during the etching of different film materials when they are present in …

    gatech Repository record for Mechanism of fluoride-based etch and clean processes (opens in a new tab)

  5. Screening experiment for a polysilicon gate etch chamber

    Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1999.

    mit Repository record for Screening experiment for a polysilicon gate etch chamber (opens in a new tab)

  6. Evaluation of unsaturated fluorocarbons for dielectric Etch applications

    … as perfluorocompounds (PFCs) for dielectric etch applications. The release of global warming compounds from this and other sources is suspected to result in changes in the earth's climate and weather patterns. Quantitative targets for emissions reduction set by the World Semiconductor Council …

    mit Repository record for Evaluation of unsaturated fluorocarbons for dielectric Etch applications (opens in a new tab)

  7. Physics-Informed Deep Learning for Plasma Etch Optimization

    Modeling the plasma etch process is highly valuable in the field of semiconductor manufacturing. This intricate process relies on the execution of numerous individual processes, numbering in the hundreds to thousands. The application of artificial intelligence (AI) and machine learning (ML) …

    mit Repository record for Physics-Informed Deep Learning for Plasma Etch Optimization (opens in a new tab)

  8. Unsupervised Feature Extraction Techniques for Plasma Semiconductor Etch Processes

    … on semiconductor chips continue to shrink plasma etching is becoming a more and more critical process in achieving low cost high-volume manufacturing. Due to the highly complex physics of plasma and chemical reactions between plasma species, control of plasma etch processes is one of the most …

    maynooth Repository record for Unsupervised Feature Extraction Techniques for Plasma Semiconductor Etch Processes (opens in a new tab)

  9. Real time interferometric imaging of the plasma etch process

    Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1994.

    mit Repository record for Real time interferometric imaging of the plasma etch process (opens in a new tab)

  10. Mutational analysis of the tobacco etch potyvirus cylindrical inclusion protein

    The CI protein of tobacco etch potyvirus is known to be an NTPase as well as a putative RNA helicase. In a previous study, the CI gene and three mutants were constructed and expressed in the E. coli expression vector pET 11a. In this study the TEV CI gene was cloned into E. coli expression vector …

    wayne-thes Repository record for Mutational analysis of the tobacco etch potyvirus cylindrical inclusion protein (opens in a new tab)

  11. Development of novel alternative chemistry processes for dielectric etch applications

    … is to identify and develop novel replacement etchants for these applications. The focus of the author's Ph.D. thesis is the patterning application. The research discussed in this document constitutes a follow up to the author's M.S. thesis, which discussed the initial stages of this project. …

    mit Repository record for Development of novel alternative chemistry processes for dielectric etch applications (opens in a new tab)

  12. Characterization, optimization, and simulation in through silicon via (TSV) dry etch

    Two approaches of through-silicon-via (TSV) etching methods, the Bosch process (alternating etching/passivation phases) and the single-step etching, have been experimentally investigated and theoretically modeled in this study. Parameter ramping and post-etch plasma treatment techniques have been …

    uiuc Repository record for Characterization, optimization, and simulation in through silicon via (TSV) dry etch (opens in a new tab)

  13. Characterization and modeling of plasma etch pattern dependencies in integrated circuits

    … capturing pattern dependent effects in plasma etching of integrated circuits (ICs) is presented. Plasma etching is a key process for pattern formation in IC manufacturing. Unfortunately, pattern dependent non-uniformities arise in plasma etching due to microloading and RIE lag. This thesis …

    mit Repository record for Characterization and modeling of plasma etch pattern dependencies in integrated circuits (opens in a new tab)

  14. Transport and Agglomeration of Dust Contaminant Particles in Reactive Ion Etch Reactors

    The morphology of the agglomerates formed was also found to be dependent on plasma conditions. Agglomerates generally grow either in a diffusive or ballistic manner. Neutral gas flow in the reactor has been found to be a useful means of controlling contamination. Higher flow rates can sweep dust …

    uiuc Repository record for Transport and Agglomeration of Dust Contaminant Particles in Reactive Ion Etch Reactors (opens in a new tab)

  15. Control of a semiconductor dry etch process using variation and correlation analyses

    … how to effectively apply SPC to a dry etch process (in this case plasma ashing), at Analog Devices, Inc., a company that runs large-scale fabrication sites in the Boston area. This thesis focuses on spatial and run-to-run variation across multiple measurement sites on a wafer and …

    mit Repository record for Control of a semiconductor dry etch process using variation and correlation analyses (opens in a new tab)

  16. Shear Bond Strengths Of A Two-Step Self-Etch Adhesive And A Three-Step Etch-And-Rinse Adhesive In Artificial Dentin Caries Lesions Of Various Depths: An In Vitro Study

    … the shear bond strengths of a two-step self-etch adhesive and a three-step etch-and-rinse adhesive to moderate and severe artificial dentin caries. Methods: 96 bovine incisors were prepared and assigned to experimental groups of moderate or severe artificial dentin caries lesions or control …

    iupui Repository record for Shear Bond Strengths Of A Two-Step Self-Etch Adhesive And A Three-Step Etch-And-Rinse Adhesive In Artificial Dentin Caries Lesions Of Various Depths: An In Vitro Study (opens in a new tab)

  17. Novel etch studies and passivation techniques on InAs/GaSb superlattice based infrared detectors

    … formation of unsatisfied chemical bonds on the etched surfaces and hence enhancing the surface leakage currents. More-over, with the scaling of single pixel dimensions, the performance of focal plane arrays is strongly dependent on surface effects due to the large pixels surface to volume ratio. …

    unm Repository record for Novel etch studies and passivation techniques on InAs/GaSb superlattice based infrared detectors (opens in a new tab)

  18. Insertion of metal oxides into block copolymer nanopatterns as robust etch masks for nanolithography

    … of semiconductor features from nanoscale on-chip etch masks using “high χ” BCP materials. Fabrication of silicon and germanium nanofins via metal-oxide enhanced BCP on-chip etch masks that might be of importance for future Fin-field effect transistor (FinFETs) application are detailed.

    cork Repository record for Insertion of metal oxides into block copolymer nanopatterns as robust etch masks for nanolithography (opens in a new tab)

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