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Showing 1 to 12 of 12 for “"Three Dimensional Integration"”.
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Copper wafer bonding in three-dimensional integration
Three-dimensional (3D) integration, in which multiple layers of devices are stacked with high density of interconnects between the layers, offers solutions for problems when the critical dimensions in integrated circuits keep shrinking. Copper wafer bonding has been considered as a strong candidate …
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An evaluation of three dimensional integration technology
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999.
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Three dimensional integration technology using copper wafer bonding
With 3-D integration, the added vertical component could theoretically increase the device density per footprint ratio of a given chip by n-fold, provide a means of heterogeneous integration of devices fabricated from different technologies, and reduce the global RC delay to a non-factor in …
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Design automation and analysis of three-dimensional integrated circuits
… and systems for an emerging technology known as three-dimensional integration. By stacking individual components, dice, or whole wafers using a high-density electromechanical interconnect, three-dimensional integration can achieve scalability and performance exceeding that of conventional …
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Development of an architectural design tool for 3-D VLSI sensors
Three dimensional integration schemes for VLSI have the potential for enabling the development of new high-performance architectures for applications such as focal plane sensors. Due to the high costs involved in 3-D VLSI fabrication and the fabrication complexity of 3-D integration, analysis of …
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Application of three-dimensional circuit integration to global clock distribution
… the clock signal. In this paper utilization of three-dimensional circuit integration to reduce the negative effects of technology scaling on clock signal distribution is investigated. A design is proposed that removes the clock distribution network from the same active plane as the logical …
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Hemispheric solution of the Omega equation including terrain and surface frictional effects
… detail and applied at the earth's surface. The three-dimensional integration of the resulting equations excludes areas "inside" the terrain. The mathematical model is programmed for the Control Data Corporation 1604 digital computer to utilize the operational output of machine processed data and …
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Numerical Modeling Analysis of Wafer Warpage and Carrier Mobility Change due to Tapered Through-Silicon-Via Geometry
Three-dimensional integration is a solution that vertically stacks multiple layers of silicon chips by Through-Silicon-Vias (TSVs) to enhance the performance of microelectronic devices. The tapered TSV profile can help to overcome the technical difficulties. However, an easily overlooked issue is …
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Advanced instrumented stamps for micro transfer printing and novel application areas
… functional micro/nano scale devices into two and three dimensional spatial arrangements. It provides a versatile route for realizing multifunctional heterogeneously integrated systems such as flexible electronics, biocompatible sensing and therapeutic devices, transparent and curved optoelectronic …
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Attosecond timing jitter modelocked lasers and ultralow phase noise photonic microwave oscillators
… advance in silicon photonics and wafer-scale three-dimensional integration technology illuminates a pathway toward on-chip photonic microwave oscillators. Phase noise model of the proposed Erbium Silicon Photonics Integrated OscillatoR (ESPIOR) suggests that it is possible to achieve …
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Laser Crystallization of Silicon Thin Films for Three-Dimensional Integrated Circuits
The three-dimensional integration of microelectronics is a standard that has been actively pursued by numerous researchers in a variety of technical ways over the years. The primary aim of three-dimensional integration is to alleviate the well-known issues associated with device shrinking in …
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Large grain Ge growth on amorphous substrates for CMOS back-end-of-line integration of active optoelectronic devices
… counts, is to monolithically implement dense threedimensional integration of electronics and photonics. This involves moving the photonic devices off the substrate, and into the metal interconnect stack. Moving photonic devices into the interconnect stack imposes two fabrication limitations. …