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Showing 1 to 20 of 1135 for “"IC"”.

  1. Ic-Rest(2): A Time-to-Market Driven IC Reliability Statistics Tool

    … rate equations (in time and space) under static and dynamic operation. The predicted failure statistics are best described by the generalized Gamma-distribution (or more accurately the generalized B-distribution) and on a Gumbel plot look more Weibull than Log-normal .

    uiuc Repository record for Ic-Rest(2): A Time-to-Market Driven IC Reliability Statistics Tool (opens in a new tab)

  2. Motor and Neurophysiological Effects of Ischemic Conditioning (IC) and Tele-Based IC in Chronic Stroke

    This dissertation examines the influence of ischemic conditioning (IC) on motor and neurophysiological outcomes in individuals with chronic stroke. Using neurophysiological measures to evaluate corticomotor excitability and transcallosal inhibition (TCI), these studies tested whether IC and …

    uic

  3. Agile Testing Methods for IC Radios

    … in Broadcom\u201fs WLAN and cellular chips. Verification and hardware testing for the radio is completed at the end of the development cycle by the fabrication of test chips which contain only radio specific hardware. Utilizing test chips allow for component specific design verification, …

    unm Repository record for Agile Testing Methods for IC Radios (opens in a new tab)

  4. Carbon nanotube interconnects for IC chips

    … as interconnects for Integrated Circuit (IC) chips. Being ballistic conductors, CNTs are capable of carrying higher current densities of up to 10¹⁰A/cm² and high thermal conductivity. This thesis examines the technological aspect of carbon nanotubes - how these tubes can excel in place of …

    mit Repository record for Carbon nanotube interconnects for IC chips (opens in a new tab)

  5. Towards a poly-phon-ic environment

    … environment where polyphonic metaphors are the means for exploration and investigation. Polyphonic, as described in musical definitions/ terms, is the style of composition in which two or more distinctly independent but organically related parts sound against one another. …

    mit Repository record for Towards a poly-phon-ic environment (opens in a new tab)

  6. Non-invasive IC tomography using spatial correlations

    We introduce a new methodology for post-silicon characterization of the gate-level variations in a manufactured Integrated Circuit (IC). The estimated characteristics are based on the power and the delay measurements that are affected by the process variations. The power (delay) variations are …

    rice Repository record for Non-invasive IC tomography using spatial correlations (opens in a new tab)

  7. Analog-digital co-existence in 3D-IC

    Ubiquitous mobile communication creates an increasing demand for high data rates, complex modulation schemes and low power design. The cost and performance benefits of conventional lithographic scaling are diminishing as process cost increases exponentially. 3D integration has the potential to keep …

    mit Repository record for Analog-digital co-existence in 3D-IC (opens in a new tab)

  8. A cost quality model for CMOS IC design

    … integration (VLSI) complementary metal oxide semiconductor (CMOS) technology, the number of transistors that can be integrated on a single chip is increasing rapidly. Ensuring that these extremely dense chips are almost free of defects, and at the same time, cost-effective requires planning from …

    vt Repository record for A cost quality model for CMOS IC design (opens in a new tab)

  9. Digitally-Assisted RF IC Design Techniques for Reliable Performance

    <p>Semiconductor industries have competitively scaled down CMOS devices to attain benefits of low cost, high performance, and high integration density in digital integrated circuits. On the other hand, deep scaled technologies inextricably accompany a large process variation, supply voltage …

    purdue-thes Repository record for Digitally-Assisted RF IC Design Techniques for Reliable Performance (opens in a new tab)

  10. HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES

    Plastic-encapsulated packages are susceptible to moisture-induced cracking due to high moisture permeability of the typical epoxy molding compound. During solder reflow, the high temperature together with the previously absorbed moisture will result in high hygrothermal stresses at material …

    nus Repository record for HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES (opens in a new tab)

  11. Automated calculation of device sizes for digital IC designs

    … Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1982.

    mit Repository record for Automated calculation of device sizes for digital IC designs (opens in a new tab)

  12. Numerical simulation of interface delamination - with application to IC packaging

    Numerical simulation is employed to gain a deeper understanding on interface delamination in IC packages during reflow soldering. Using the vapor pressure incorporated cell element model, the research concentrates on identifying the possible crack initiation mechanisms, and also the crack …

    nus Repository record for Numerical simulation of interface delamination - with application to IC packaging (opens in a new tab)

  13. New approaches for optical and microoptical diagnostics in IC engines

    … requires fast, non-invasive in-situ diagnostics methods. Hence, laser-based optical diagnostics are essential for internal combustion (IC) engine research. Within this work, microoptical systems that enable the ap-plication of optical diagnostics methods on unmodified production-line engines …

    heid-diss Repository record for New approaches for optical and microoptical diagnostics in IC engines (opens in a new tab)

  14. Simulation of Turbulent Flames at Conditions Related to IC Engines

    … a closer under- standing of the in-cylinder physical and chemical processes, which can be obtained either through experiments or simulations. The advent of computational hardware, methodologies and modelling approaches in recent times make computational uid dynamics (CFD) an important and …

    cambridge Repository record for Simulation of Turbulent Flames at Conditions Related to IC Engines (opens in a new tab)

  15. Monolithically integrated MEMS resonators and oscillators in standard IC technology

    … sources and high quality filters based on mechanical resonators are essential building blocks for communication systems as well as analog and digital electronics. Driven by the continuous demand for reduction in power, size and overall cost, monolithic integration of mechanical resonators in …

    mit Repository record for Monolithically integrated MEMS resonators and oscillators in standard IC technology (opens in a new tab)

  16. Implementation of Refractory Foam Technology for Silencing Small IC Engines

    With the need for stealth in defense applications steadily increasing, noise reduction continues to play an important role in the world of aeronautics. With the ever increasing number of small UAV flight vehicle designs and their stringent weight requirements, acoustic solutions become …

    vt Repository record for Implementation of Refractory Foam Technology for Silencing Small IC Engines (opens in a new tab)

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